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19.09.2007 - AMD lancia tre Athlon 64 single-core a bassissimo TDP |
Mediante il comunicato stampa di seguito allegato, AMD ha lanciato tre nuovi processori Athlon 64 a basso consumo, concepiti per l'impiego con i sistemi embedded come Network Attached Storage (NAS) o apparati utilizzati nel mondo delle TLC. I nuovi Athlon 64 sono chip a single-core, con socket AM2; sono caratterizzati da un PR pari rispettivamente a 2000+, 2600+ e 3100+ mentre il valore massimo del TDP - o Thermal Design Power - è pari nei tre casi a 8, 15 e 25W. Arriveranno sul mercato nell'ultimo trimestre di quest'anno. BOSTON -- September 19, 2007 --At the Embedded Systems Conference this week, AMD announced the addition of three new low power AMD Athlon 64 processors to its embedded product lineup, giving embedded systems designers the benefits of AMD64 technology in a thermal envelope as low as 8 watts. These AM2 socket-compatible, single core processors further enhance the available options for deploying industry-changing AMD64 technology in embedded systems. “These new additions offer very low power and innovative processor features that can specifically address a range of embedded markets and they add to the multitude of power, price and performance combinations that AMD offers embedded system designers,” said Buddy Broeker, director of Embedded Computing Solutions, AMD. “We are also dedicated to helping manage infrastructure changes. Our new processors are compatible with existing AM2 boards, giving designers a more robust menu of processor options on a ready-to-go platform. This can speed time to market and decrease development costs.” The readily available infrastructure supporting the new offerings means customers can either upgrade or use their existing board designs to address new markets, especially those that require low power draw and heat dissipation. Customers with a readily available platform include Aaeon, Albatron, iBase, ICP, iEi, and WinMate Communication. The AMD Athlon 64 processor Models 2000+, 2600+, and 3100+ feature power envelopes of 8, 15, and 25W maximum thermal design power, respectively. They support ECC memory for high reliability data applications and are especially applicable for systems such as Network Attached Storage (NAS), Advanced Mezzanine Cards (AMCs) for the telecommunications market, and various single board computing and industrial implementations. These models will be generally available in Q4. There have been more than a dozen additions or enhancements to the AMD Embedded Solutions family of processors and development systems so far this year. AMD plans to continue the push for choice and innovation in the embedded space well into the future. Products as wide ranging as the recently discussed “Bobcat” family of processors and the newly announced Quad-core AMD Opteron™ processor, formerly code-named “Barcelona,” represent future possibilities for embedded designs that could range from the ultimate visual experience in an ultra-low power portable device to leading-edge enterprise-class performance in a telecommunications blade or storage system. News Source: AMD Press Release Links |
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